CW020: The extra-fine one.
Dry levelling fill, fill height: 0 – 20 mm
The alternative to hydraulically setting levelling and smoothing compounds: With its optimised, narrow-band grain distribution combined with the specially elongated grain shape of the individual chip, the product is particularly suitable for the traditional area of application of hydraulically setting levelling and smoothing compounds. CW020 is an innovative new development for thin-layer levelling up to 20 millimetres on ceiling panels. CW020 is applied dry and is a quick and inexpensive alternative solution to the conventional systems.