Products 
CW020: The extra-fine one.
Dry levelling fill, fill height: 0 – 20 mm
The alternative to hydraulically setting levelling and smoothing compounds: With its optimised, narrow-band grain distribution combined with the specially elongated grain shape of the individual chip, the product is particularly suitable for the traditional area of application of hydraulically setting levelling and smoothing compounds. CW020 is an innovative new development for thin-layer levelling up to 20 millimetres on ceiling panels. CW020 is applied dry and is a quick and inexpensive alternative solution to the conventional systems.
Areas of application CW 020
Levelling fill on
- Concrete ceilings
- Screed surfaces
- Wooden ceilings
Product advantages
- For zero levelling areas
- Resistant to mould, fungi, rodents
- No swelling or shrinkage
- Low weight
- Quick processing without water
- No binders
- Can be walked on immediately after application
- No waste material
Technical data
Material required for each cm of fill height 10 litres per m²
| Chip size | 1 – 2 mm |
| Fire behaviour | Class Bfl-S1 |
| Thermal conductivity | 0,085 W/mK |
| Bulk density | approx. 320 kg/m³ |
| Uniform load distribution | 3,2 kg cm of height |
| Installation height | 0-20 mm |
| Packaging unit | 50 litres |
Application examples
